SEMICUBE

PRODUCT

MicroSense

MicroSense DNA

MicroSense Wafer Geometry Measurement

MicroSense capacitance sensor based metrology systems perform full wafer mapping, generating high resolution geometry data for each wafer.
Wafer metrics include thickness, flatness, bow and warp.

Thickness, Flatness

Bow, Warp

Thin Film Stress

New UltraMap C200L 200mm Bare Silicon Wafer Geometry System

UMA-C200L

Measurement Technology Capacitance (industry baseline, same as ADE)

Measurements: Thickness, Flatness, SFQR (site flatness), Bow, Warp, Resistivity, P N Type

Applications: HVM Final Inspection of Bare and Epitaxial 200mm Silicon Wafers

Correlates to existing ADE results (QC Record) with Better than ADE Capability: > 1.25x throughput in smaller footprint; Higher resolution and greater repeatability; Much improved reliability and reduced downtime

200mm Wafer Thin Film Stress Metrology System

UMA-C200-STR

Measurement Technology Capacitance

Measurements: Wafer Thickness and Shape, for Thin Film Stress Analysis

Applications: In process thin film stress monitoring of silicon, SiC and sapphire devicewafers. Supports data handling for multiple deposition steps.

Correlates to existing Flexus results (QC Record) with Better than Flexus Capability: True full wafer 2D stress mapping; >120,000 measured data points per wafer; High throughput production tool

200mm Backgrind Device Wafer Thickness Metrology System

UMA-200-BP

Measurement Technology Backpressure

Measurements: Thickness and Flatness

Applications: Thickness and flatness monitoring of thinned backgrind wafers wafer only, wafer on carrier, wafer on tape

Material agnostic system silicon, SiC, sapphire, compound materials GaAs, InP

Measures ‹100 µm thick wafers

UltraMap 200mm Wafer Geometry Product Line

Application	Thickness, Flatness, Shape	Stress	Backgrind Thickness
Application	UMA-C200L (200mm bare silicon wafers)	UMA-C200-STR (150/200mm silicon full wafer stress)	UMA-200-BP (150/200mm thinned back grind wafers, material independent)
Market	Bare Wafer Manufacturing	Device Manufacturing - Front End	Device Manufacturing - Back End

Application	Semi-auto benchtop		Manual benchtop
Application	UMS-C200B (100/150/200mm silicon, SiC, sapphire)	UMS-200-BPBT (100/150/200mm thinned back grind wafers, material independent)	UMM-BP1V-X30 (Up to 300mm, thinned back grind wafer)
Market	Development & Low Volume		Thinned wafer on film, Saw frame